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Consumables for fine grinding 

In general, the abrasive for fine grinding should be very hard, so that the removal rate of the workpiece is higher than the fixed material removal rate of the fine grinding wheel. Ideally, the abrasive maintains its sharpness to keep the cutting stable throughout a long period of time. 

 In addition, the fine grinding abrasive should have sufficient thermal resistance so that the grain can withstand both high processing temperatures and rapid temperature changes. 

• Fine grinding at Lapmaster Wolters is a batch-mode abrasive machining process that combines the speed and aggressiveness of super abrasive wheels with accuracy of lapping kinematics to produce flat and parallel work piece surfaces.
• At double sided fine grinding, the fine grinding cutting tool consists of an upper and lower wheel composed of diamond or cubic boron nitride (CBN) with different bond types (vitrified bond, resin bond or metal bond) and act as the support plates for the work pieces.
• The double-sided fine grinding machine has evolved from the vertical double-wheel lapping machine design with a planetary work drive system, also known as “lapping kinematics”. 

The term lapping is used to describe a number of various surface finishing operations where loose abrasive powders are used as the grinding agent at normally low speeds. It is a process reserved for products that demand very tight tolerances of flatness, parallelism, thickness or finish. 

Pitch polishing is a similar concept to the lapping process except it is using a pitch plate and much finer polishing media. Lapmaster Wolters is a manufacturer of single-sided pitch polishing machines for a wide range of optical components, e.g. optical surfaces, filters, prisms and for the reconditioning of our customers' optical components. Typically, components range in size from 20mm diameter to 600mm diameter. Other sizes are achievable depending on both machine and component size and type. Significant skill is required for pitch polishing, achieving tighter tolerances for surface flatness, roughness, parallelism, and cosmetics than you would achieve using the conventional lapping process with coarser abrasives. 

• Polishing is a process to generate a reflective surface
• Normally, the polish is generated by using a fine-micron or sub-micron abrasive particle in combination with a liquid. Polishing is a “wet” process.
• Often the polishing process utilizes a pad to contain the abrasive, so polishing may not be a “loose abrasive process.” The pad is softer than the part.
• Very little material is removed during the polishing process, normally measured in microns or nanometers
• The surface finish of the work piece to be polished must be of high quality. The pre-polishing process is often a "lapped" surface.. 

Overhaul of the wire guide rollers 

• Is essential to ensure good wire guide roll performance
• Wire guide rolls are a core part of a wire saw
• Has direct influence on slicing quality
• Over time of use, the grooves become worn from abrasion and stress, which reduces the slicing performance
• New coating, new grooves, and replacement of mechanical components subject to wear ensure smooth rotation of the wire guide rolls and the wire web. 

The term "lapping" is used to describe a number of various surface finishing operations where loose abrasive powders are used as the grinding agent at normally low speeds. It is a process reserved for products that demand very tight tolerances of flatness, parallelism, thickness or finish. 

Thru-Feed Grinding is a production flat machining process that does almost everything a conventional single-side, double side or vertical spindle grinder can do. Thru-feed grinding is the most efficient method known for high production surface grinding of small to mid size parts because it practically eliminates non-productive time. With the Thru-Feed Grinder, all machine time is grinding time, little is lost on fix-turing and preparation such as set-up, and loading and unloading of parts. Parts of almost any material and shape are fed into the Thru-Feed Grinder via a conveyor belt passing beneath a grinding wheel and finished parts are discharged continuously. It’s truly a high production grinding system. 

Wafer slicing with slurry wire vs. with diamond wire 

Wire slicing with lose abrasive slurry 

An abrasive mixture consists of glycol or oil with unbound cutting grit such as silicon carbide or diamonds, whereby the material is removed in a lapping process. The grit particles roll between wire and material, therefore the particle speed is max ½ of the wire speed. 

• Method of creating a reflective surface
• The polishing media typically consists of fine-grained or submicron abrasive particles in combination with a liquid.
• Polishing is a "wet" process.
• Often, the polishing process uses a pad to hold the abrasive so that polishing cannot be a “loose sanding process.”
• Very little material is removed during polishing, usually measured in microns.
• The surface condition of the workpiece to be polished must be high quality before the polishing process. SiC machining usually involves a wire sawing process.
• Different polishing processes can be combined to optimize the CoO across the entire process chain.
• DMP is used in the SiC area as a pre-process for the CMP step

• Method of creating a reflective surface
• The polishing media typically consists of fine-grained or submicron abrasive particles in combination with a liquid.
• Polishing is a "wet" process.
• Often, the polishing process uses a pad to hold the abrasive so that polishing cannot be a “loose sanding process.”
• Very little material is removed during polishing, usually measured in microns.
• The surface condition of the workpiece to be polished must be high quality before the polishing process. In the case of SiC machining, this is usually a DMP process.
• Different polishing processes can be combined to optimize the CoO across the entire process chain.
• In the field of SiC processing, CMP is the final process step in the surface treatment of wafers.