6 EZ
Polishing Machine
It’s no secret that SiC is a hard material to process. We understand the challenges of working with SiC and we have applied
our knowledge of SiC grinding, prime wafer polishing, and CMP technology to develop a unique solution that truly makes polishing SiC easy.
- Fully-automated, cassette-to-cassette handling
- Three tables with dedicated carriers, pad conditioners, and pad cleaners
Characteristics 6 EZ Polishing Machine
- Fully-automated,cassette-to- cassette handling
- Single wafer processing for excellent wafer-to-wafer control
- Single-side and two-sided polish
- Three tables with dedicated carriers, pad conditioners, and pad cleaners
- Acid-resistant components
- OCR (optional)
- State-of-the-art control architecture and Windowsbased operating system
- Two standard slurry delivery lines, optional third slurry line available
- Factory host communication(optional)
- SEMI S2, S8, and CE certified
- 50-wafer processing without operator intervention
- Integrated post-polish clean
We think ahead because full service starts with the product.
We ensure security. As a full-service provider, we offer everything you need to guarantee that your processes run like clockwork.
ConsumablesCustomized full-service offers for maximum production reliability.
Service