DS261
Multi Wire Slurry Saw
The DS261 yields top technological and qualitative performances. First-class surfaces of the slurry-sliced wafers, as well as best warp and TTV values, make the DS261 the leading wire saw in the 300mm semiconductor industry.
- Excellent results in nano-topology
- New operator guided HMI and electrical system on series 7
Work piece dimensions:
max. Ø 300 × 400 mm
Characteristics DS261 Slicing Saws
- New operator guided HMI and electrical system on Series 7 release
- Wide range of applications: silicon, quartz, gallium arsenide and other hard & brittle material in different dimensions
- Proven slurry technology and DW ready
- Optimized slurry temperature control
- 60-step recipe enables optimal process tuning
- Automated cutting process and perfect accessability
- Optional work piece orientation
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ConsumablesCustomized full-service offers for maximum production reliability.
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