DW292
Multi Wire Saw
The DW292 is specifically designed for slicing mono-Si blocks into high-quality wafers for the demanding semiconductor industry. It can operate with both slurry and diamond wire and has high wafer quality features.
- Lowest TTV and warp values
- High throughput thanks to high wire speed and extended wire web
Work piece dimensions:
max. Ø 305 mm × 600 mm or Ø 205 mm x 650 mm
Brand: Peter Wolters

Characteristics DW292 Slicing Saws
- Sophisticated work piece rocking for maximum precision
- High throughput: 35 m/s wire speed, 12 m/s2 acceleration
- DWMS: 60 μm wire capability
- Shortest wire path: Only < 1.9 m on one side, easy wire set-up and constant tension
- Robust machine: Mineral cast, low temperature dependency, low vibration, low noise
- HMI: New HMI on 19″ touch screen, production assistant, global process recipes, easy to train, easy to use
- Option: Automatic cutting fluid exchange
- Option: MES interface (SECS / GEM)
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ConsumablesCustomized full-service offers for maximum production reliability.
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