DW296
Multi Wire Saw
Designed specifically for cutting square monocrystalline silicon bricks into ultra-thin wafers for the photovoltaic industry, the DW296 sets industry standards for thinnest wires and fastest wafer slicing times
- Sophisticated wire tension management for thin wire and high acceleration reduces the wire breakage rate
- Extremely high throughput for photovoltaic wafer mass production
Work piece dimensions:
max. 210 x 210 x 860 mm
Characteristics DW296 Slicing Saws
- M12 capable:
Optimized for 210 mm and 182 mm
wafer format (other formats possible) - Up to 100 MW throughput:
15 m/s2 acceleration,
40 m/s wire speed - 30 µm wire capability
- Shortest wire path:
Only < 2.0 m on one side, easy
wire set-up and constant tension - High capacity: 870 mm web length
- Robust machine: Iron cast, high
rigidity, perfect alignment of all relevant machine parts
- HMI: New HMI on 19″ touch screen,
production assistant, global process
recipes, easy to train, easy to use - Simplified cutting fluid supply with
pre-cleaning function - Optional MES interface
(SECS/GEM300)
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ConsumablesCustomized full-service offers for maximum production reliability.
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